Time Data for epoxy cure test at three different temperatures. Rheocalc32.exe is the most common filename for this program's installer. time for three different control temperatures: 23☌, 50☌ and 60☌.įigure 3: Viscosity vs. The actual developer of the program is Brookfield Engineering Labs. The reaction or “cure” proceeds faster as the test temperature is increased. Spindle speed decreases by an order of magnitude with each successive time interval.įigure 2: Spindle Speed vs. The left-most curve is the torque data at 100 rpm the right-most curve is 0.01 RPM. Figure 1 shows the data.Įach curve represents data for a differentĮach curve in Figure 2 represents rotational speeds for the spindle. The program ended the run when 90% of FSR was reached at the slowest speed – in this case, 0.01 RPM.
Rheocalc brookfield full#
Each time the measured torque reached 90% of Full Scale Range or “FSR”, the speed was decreased by a factor of 10. The viscosity increased as the epoxy system reacted or cured. In the following example, Brookfield DV3TLV was used with SC4-27RD disposable spindles and SC4-13RD disposable sample chambers.
Rheocalc brookfield software#
The software “wizard” in Rheocalc is used – “Cure Mode” is selected, and the wizard guides the user in setting up a test. Brookfield Rheocalc™ software is used for instrument control and data acquisition. This algorithm allows data to be taken over very large viscosity ranges – several decades, in fact. They could not afford expensive rheometers that would monitor gelation or “curing” of materials such as epoxies. The Cure Mode algorithm was developed in response to customer concern that their gel timers did not provide viscosity or rheological data. Speed: Various possibilities: 100 to 0.01 RPM Spindle: Choice of either standard spindles, or preferably, disposable spindles and chambers for easy cleanup.Īccessories: Various choices: Small Sample Adapter, TC-550AP Programmable Bath, Thermosel™ with Programmable Controller Various materials such as epoxies or other composite resins, slow curing adhesives, gelatins or hydrocarbon gels.
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